![]() ![]() Li, Rapid formation of Cu–Cu joints with high shear strength using multiple-flocculated Ag nanoparticle paste. Chen, Novel Cu–Ag composite nanoparticle paste for low temperature bonding. Li, Ag microflake-reinforced nano-Ag paste with high mechanical reliability for high-temperature applications. Zhou, Preparation of PVP coated Cu NPs and the application for low-temperature bonding. Johnson, Attenuation in silver-filled conductive epoxy interconnects. Wong, One-step preparation of silver hexagonal microsheets as electrically conductive adhesive fillers for printed electronics. Ma, Silver flakes and silver dendrites for hybrid electrically conductive adhesives with enhanced conductivity. Kuan Yew, Die attach materials for high temperature applications: a review. Chen, Effects of minor Cu and Zn additions on the thermal, microstructure and tensile properties of Sn–Bi-based solder alloys. Yao, Effect of In on microstructure, thermodynamic characteristic and mechanical properties of Sn–Bi based lead-free solder. Jung, Microstructural evolution of Sn-rich Au–Sn/Ni flip-chip solder joints under high temperature storage testing conditions. Selvaduray, Lead-free solders in microelectronics. Hopkins, Thermomigration in Pb–Sn solder joints under joule heating during electric current stressing. Amagai, Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb–Sn solder. (Trans Tech Publications, Aedermannsdorf, 2010), pp. Lelis, Performance, reliability, and robustness of 4H-SiC power DMOSFETs, in Materials Science Forum. Nogi, Low-temperature low-pressure die attach with hybrid silver particle paste. Tournier, State of the art of high temperature power electronics. Ismail, A review on die attach materials for sic-based high-temperature power devices. This means that the synthesized special dendritic Ag nanostructure has an excellent potential as a high-performance die attach material for high- and low-temperature power device. The thermal resistance and electrical conductivity of these interconnect joints were about 78.89 Wm −1 K −1 and 9.85 × 10 –6 Ω cm, respectively, which makes its further interconnect applications feasible. In addition, the interconnect joint formed from dendritic Ag nanostructures also exhibited high reliability, and it still maintained a high shear strength of 27 ± 2 MPa even after 1000 cycles thermal quenching between − 55 and 125 ☌. We think that the dramatic increment in the shear strength may result from the higher contact area of nanoscale primary branches of the synthesized dendritic structures than Ag microstructures and the low-temperature sintering of their nanoscale primary branches. Remarkably, the shear strength of the interconnect joints formed from dendritic Ag nanostructures could reach around 21 MPa after sintering for 30 min at 250 ☌ under a pressure of 10 MPa, whereas the shear strengths of the interconnect joints, which formed from Ag microspheres and microflakes under similar conditions, were only 9 MPa and 11 MPa. Subsequently, the sintering behavior of the obtained dendritic Ag nanostructures, as low-temperature interconnect material, was systematically investigated under different sintering conditions. In this work, Cu foil and AgNO 3 were used as raw materials to synthesize dendritic silver nanostructure with a central trunk of 5–10 μm along with many primary branches of 200 nm. Electrically conductive epoxy adhesive, which combines with Ag sintering materials rather than traditional Pb-based solder materials, attracts wide research interest in modern die attach technology for power electronic packaging owing to its advantages of low processing temperature and high working temperature. ![]()
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